BS EN 62007-1:2009 pdf download – Semiconductor optoelectronic devices for fibre optic system applications — Part 1: Specification template for essential ratings and characteristics
5.6 Supplementary information
5.6.1 DC forward current of the laser diode corresponding to φ eoo .
NOTE φ eoo : radiant power value of the laser chip on submount, representative of the performance and reliability of devices manufactured using the same technology and submitted to the same quality assurance procedures.
5.6.2 Response time of the thermistor temperature to the change of cooler current (where appropriate).
5.6.3 Thermal resistance between laser diode junction and case (without cooler): R thj-c .
5.6.4 s 1 1 parameter.
See IEC 60825.
6 PIN photodiodes for fibre optic systems or subsystems
Ambient-rated or case-rated PIN photodiodes with or without optical fibre pigtail for fibre optic systems or subsystems.
6.2 Semiconductor materials
Si, Ge, InGaAs, etc.
6.3 Details of outline and encapsulation
6.3.1 IEC and/or national reference number of outline drawing.
6.3.2 Method of encapsulation: glass/metal/plastic/other.
6.3.3 Terminal identification and indication of any electrical connection between a terminal and the case.
6.3.4 Characteristics of the optical port: relative orientation to mechanical axis, relative position to mechanical axis, area, numerical aperture.
6.3.5 For devices with pigtail: information on the pigtail fibre, type of fibre, kind of protection,connector, length.
6.3.6 Information on the heat sink of the package.
6.6 Supplementary information
6.6.1 Typical curve of dark current versus voltage, at different temperatures.
6.6.2 Typical curve of total capacitance versus reverse voltage.
6.6.3 Relative sensitivity versus wavelength.
6.6.4 Relative sensitivity versus temperature.
6.6.5 Derating curve or derating factor of maximum dissipation.
7 Avalanche photodiodes (APDs) with or without pigtails
Ambient-rated or case-rated avalanche photodiode for fibre optic systems or subsystems.
Si, Ge, InGaAs, etc.
7.3 Details of outline and encapsulation
7.3.1 IEC and/or national reference number of outline drawing.
7.3.2 Method of encapsulation: glass/metal/plastic/other.
7.3.3 Terminal identification and indication of any electrical connection between a terminal and the case.
7.3.4 Characteristics of the optical port: relative orientation to the mechanical axes, relative position to mechanical axes, area, numerical aperture.
7.3.5 Information on the pigtail fibre (where appropriate): type of fibre, kind of protection, connector, length.
7.4 Limiting values (absolute maximum ratings) over the operating temperature range, unless otherwise stated
7.4.1 Minimum bend radius of the pigtail, where appropriate.
7.4.2 Minimum and maximum storage temperature (T stg ).
7.4.3 Minimum and maximum operating ambient or case temperatures (T amb or T case ).
7.4.4 Maximum soldering temperature (T sld ) (soldering time and minimum distance to case to be specified).
7.4.5 Maximum power dissipation at ambient or case temperature of 25 °C (P tot ) and derating curve or derating factor.
7.4.6 Maximum pull force for pigtail (fibre or cable), where appropriate, in the direction of the axis of the input pigtail (fibre or cable).
7.4.7 Maximum reverse current (I R ).
7.4.8 Maximum forward current (I F ).
7.5 Electrical and optical characteristics
V R shall be the same for all characteristics; it shall be equal to 0,9 of the individually measured value of V (BR) , unless otherwise specified.