BS EN ISO 9453:2020 pdf download – Soft solder alloys – Chemical compositions and forms This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included. 2 Normative references There are no normative references in this document. 3? Terms? and? definitions For the purposes of this document, the following terms and definitions apply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: — ISO Online browsing platform: available at https:// www .iso .org/ obp — IEC Electropedia: available at http:// www .electropedia .org/ 3.1 soft solder metallic filler material which is used to join metallic parts and which has a melting temperature (liquidus) lower than that of the parts to be joined and, usually, lower than 450 °C and which wets the parent metals 3.2 batch collection of one or more units of product, made in a single production operation 4 Chemical composition The chemical composition of the soft solder, sampled and analysed in accordance with Clause 6, shall be as given for the appropriate material in Table 2 or Table 3. 5 Forms of delivery 5.1 General Soft solders conforming to this document shall be supplied in one of the following forms: ingot, slab,stick, bar, rod, wire, pellets, preforms, spheres, ribbons, powder or pastes and creams containing powder. Solder shall be uniform in quality and free from detrimental conditions such as contamination or surface oxide that prevent melting and flow in a manner suitable for the intended application. NOTE 1 Solders supplied in the form of rod, wire, or preforms can be supplied with or without an integral flux, subject to agreement between the supplier and the purchaser. NOTE 2 Not all the solder compositions given in the tables are necessarily available in all the product forms listed. 5.2 Unit of product The unit of product used for defining the requirements for the marking of soft solders varies with the form of the solder (see Table 1). 6 Sampling and analysis The recommended method of analysis for soft solder alloys is induced coupled plasma (ICP). The methods used shall be agreed between the supplier and the purchaser. NOTE Other acceptable analysis methods are Spark optical emission spectrometry (Spark-OES) and atomic absorption spectroscopy (AAS). 7 Marking, labelling and packaging...
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