BS EN ISO 9453:2020 pdf download – Soft solder alloys – Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
2 Normative references
There are no normative references in this document.
3? Terms? and? definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at https:// www .iso .org/ obp
— IEC Electropedia: available at http:// www .electropedia .org/
soft solder
metallic filler material which is used to join metallic parts and which has a melting temperature (liquidus) lower than that of the parts to be joined and, usually, lower than 450 °C and which wets the parent metals
collection of one or more units of product, made in a single production operation
4 Chemical composition
The chemical composition of the soft solder, sampled and analysed in accordance with Clause 6, shall be as given for the appropriate material in Table 2 or Table 3.
5 Forms of delivery
5.1 General
Soft solders conforming to this document shall be supplied in one of the following forms: ingot, slab,stick, bar, rod, wire, pellets, preforms, spheres, ribbons, powder or pastes and creams containing powder. Solder shall be uniform in quality and free from detrimental conditions such as contamination
or surface oxide that prevent melting and flow in a manner suitable for the intended application.
NOTE 1 Solders supplied in the form of rod, wire, or preforms can be supplied with or without an integral flux, subject to agreement between the supplier and the purchaser.
NOTE 2 Not all the solder compositions given in the tables are necessarily available in all the product forms listed.
5.2 Unit of product
The unit of product used for defining the requirements for the marking of soft solders varies with the form of the solder (see Table 1).
6 Sampling and analysis
The recommended method of analysis for soft solder alloys is induced coupled plasma (ICP). The methods used shall be agreed between the supplier and the purchaser.
NOTE Other acceptable analysis methods are Spark optical emission spectrometry (Spark-OES) and atomic absorption spectroscopy (AAS).
7 Marking, labelling and packaging
Each batch of solder supplied in accordance with this document shall be marked with the information indicated by a cross in Table 4.
The information in Table 4 shall be applied to the product forms as follows:
a) for ingots and slabs: by stamping, or inkjet marking on the surface of each unit of product;
b) for sticks, bars, rods and wire in coil: either on a label securely attached to each unit of product, or on a label on the package in which the units of product are contained;
c) for wire or ribbon on reels: on a label on each reel;
d) for pellets, performs, spheres, powder, paste or cream: on a label on each individually packaged quantity;
e) all applicable health and safety markings including lead free marking or lead containing marking;
f) any other information which may be pertinent to the particular solder form.BS EN ISO 9453 pdf download.